Researchers at Pohang University of Science and Technology (POSTECH) have developed a smart dry adhesive using shape-memory polymers with densely packed nanotips, enabling precise, clean transfer of microscale components like micro-LED chips. The nanotip surface stays rough at room temperature for easy detachment but smooths under heat and pressure for strong adhesion — achieving over 15 atmospheres of bonding strength and near-zero force release when reheated. Demonstrated with robotic pick-and-place, this innovation could revolutionize display and semiconductor manufacturing by eliminating residue and simplifying microassembly processes.
