Researchers have developed a monolithic 3D chip that stacks memory and computing units vertically, dramatically speeding up data flow and overcoming limits of conventional 2D designs. Early tests show it outperforms flat chips by four times, with simulations suggesting up to twelve-fold gains for AI workloads. Built entirely in a U.S. commercial foundry, the design combines high performance with domestic manufacturability, marking a major step toward the next generation of AI hardware
